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The Evolution of AMD CPUs: Traditional Design to 3D V-Cache.

The introduction of Evolution of AMD CPUs has revolutionized the CPU market by transitioning from traditional designs to its innovative 3D V-Cache technology. This shift aims to tackle specific computational challenges, particularly in gaming and workloads benefiting from high cache availability. In this blog, we’ll explore the reasons behind this transition, the technical details of 3D V-Cache, its advantages and limitations, and how it compares to competitors like Intel.

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Why AMD Shifted to 3D V-Cache

Traditionally, CPU performance has been improved by:

1. Increasing clock speeds.
2. Enhancing IPC (Instructions Per Clock).
3. Adding more cores and threads.

However, as gaming and certain workloads became increasingly dependent on faster data retrieval and lower latency, AMD identified a bottleneck: cache limitations. Larger and faster caches help processors retrieve data from memory quicker, significantly improving performance in tasks like gaming, where rapid access to frequently used data is crucial.

AMD introduced 3D V-Cache as a solution:

• 3D stacking technology vertically integrates additional layers of cache memory onto the CPU.
• This innovation allows AMD to significantly increase cache capacity without drastically altering the die size or thermal profile.

AMD Inivates 3D V-CACHE

With the original AM-4 and then AM-5 platform 3D V-Cache AMD recently made a change in the order of the CPU’s configuration. With the introduction of its latest AMD Ryzen 7 9800X3D, it reorganising the location of the 3D V-cache. It was relocated so the V Cache didn’t have to cope with the heat from the main chiplets while operating. Reconfiguring the V-Cache and chiplet order in the construction of the CPU has made a better chip with even better performance.

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How AMD Installs 3D V-Cache on CPUs

Evolution of AMD CPUs – AM4 and AM5 Platforms

• The first 3D V-Cache CPUs, such as the Ryzen 7 5800X3D, utilized the AM4 platform. AMD added a 64MB 3D V-Cache layer atop the CPU die using TSMC’s 7nm process and advanced hybrid bonding technology. This approach minimized latency and allowed seamless communication between the cache and processor cores.
• With the release of the Ryzen 7000X3D series for the AM5 platform, AMD incorporated its 3D V-Cache onto CPUs built with TSMC’s 5nm process node. These newer CPUs offered improved efficiency and higher overall performance.

Evolution of AMD CPUs – Changes in the Latest 5900X3D Design

• The Ryzen 9 5900X3D, while based on the older AM4 platform, represents a refinement of the 3D V-Cache design.
• Unlike earlier models, AMD improved thermal efficiency and further optimized cache-to-core connectivity to enhance gaming and productivity workloads.
• The design updates focused on thermal management and better leveraging the additional cache in multicore scenarios.

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Why 3D V-Cache Excels in Gaming

Gaming workloads are often characterized by frequent and repetitive memory access:

1. Game engines: Constantly retrieve textures, geometry, AI data, and more from memory.
2. Larger caches: Reduce reliance on slower system RAM, decreasing latency and boosting frame rates, especially in CPU-bound scenarios like high refresh rate gaming or simulations.

The 3D V-Cache advantage:

• By tripling the L3 cache size, games have more room to store frequently accessed data, leading to fewer memory calls and improved performance.
• Particularly in flight simulations (e.g., Microsoft Flight Simulator, DCS World), which are notoriously CPU-bound, the added cache ensures smoother gameplay with fewer stutters.

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Future of 3D V-Cache CPUs

The future of 3D V-Cache technology looks promising:

1. Expanding applications: While gaming is the primary focus, other workloads like video editing, AI inference, and large-scale simulations also benefit.
2. Scaling up: Future CPUs may see even larger 3D V-Cache stacks, potentially integrated with more advanced packaging technologies.
3. Broader adoption: AMD’s competitors are likely to innovate in response, driving advancements in stacking technologies across the industry.

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Does Intel or Any Other Manufacturer Use 3D Cache Designs?

Currently, Intel does not use 3D V-Cache but is exploring similar 3D stacking technologies:

• Intel’s Foveros technology enables stacking different silicon layers, but it has been used more for heterogeneous designs (e.g., integrating performance and efficiency cores) rather than adding cache.
• ARM-based processors, particularly in the server and mobile sectors, have also experimented with stacking techniques, though they differ in implementation.

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Negatives of 3D V-Cache CPUs

While 3D V-Cache CPUs offer significant advantages, they also have drawbacks:

1. Thermal challenges: Adding extra cache layers increases heat density, requiring more sophisticated cooling solutions.
2. Limited scalability for certain tasks: Workloads that do not benefit from large caches (e.g., rendering or encoding) may not see meaningful performance gains.
3. Higher cost: The advanced manufacturing process increases production costs, making these CPUs pricier.

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Non-3D Cache CPUs vs. 3D Cache CPUs in Gaming and Flight Simulation

Gaming:

• Non-3D Cache CPUs: Perform well in GPU-bound scenarios or at lower resolutions, but performance can drop in CPU-intensive or high refresh rate gaming.
• 3D Cache CPUs: Excel in CPU-bound tasks, offering higher frame rates and smoother performance in games with high memory demands (e.g., large open-world titles or flight simulators).

Flight Simulation:

• Non-3D Cache CPUs: Struggle with stutters and lower frame rates in titles like Microsoft Flight Simulator, where high cache availability significantly improves data retrieval.
• 3D Cache CPUs: Show marked improvements in simulation performance, reducing latency and providing smoother gameplay, even in demanding scenarios.

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Examples of 3D Cache and Non-3D Cache CPUs

1. 3D Cache CPUs:
   • Ryzen 7 5800X3D
   • Ryzen 9 7950X3D
   • Ryzen 9 5900X3D
2. Non-3D Cache CPUs:
   • Ryzen 9 5900X (traditional design)
   • Intel Core i9-13900K

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Conclusion: The Future of 3D Cache CPUs

AMD’s 3D V-Cache technology has set a new benchmark in gaming performance and efficiency, particularly for CPU-bound tasks like flight simulations. While the technology has limitations, its gaming-focused benefits are undeniable, and its future potential is vast. With Intel and other competitors developing their own stacking technologies, 3D cache innovations will continue to shape the landscape of gaming and productivity CPUs in the coming years.

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Author

Brendon McAliece (Aka Gunnie) is a military veteran with 23 years working on Jet Fighters, their weapons systems and ejection seat/module systems as well as munitions and R&D. Involved with flight simulation since the 1980s, he has flown all the major flight simulators over the years.

He is an Australian expat who has lived in Malaysia, UK, Saudi Arabia and more recently Thailand. He is a multi-lingual blogger who loves to share his life experiences here on LetsFlyVFR.com and DreamingGuitar.com, with his lifestyle and Travel experiences Blog plus his Dreaming Coffee website.

Learn More @ DreamingGuitar.com – DreamingCoffee.com – LetsFlyVFR.com

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